Capabilities
Architecture to silicon, under one roof.
Specification, RTL, verification, analog, physical design, DFT, and bring-up — seven disciplines that have to agree for a chip to actually work. One team owns all of them.
Book a callArchitecture
Specification and architecture
A spec is more than a feature list. We work the spec until block partitioning, process node, IP strategy, and tape-out plan all line up with budget and schedule.
- Product spec and architecture document
- Block partitioning and floorplan
- Node and foundry selection
- IP licensing strategy
- Tape-out plan and budget
- Risk register against first silicon
RTL design
Verilog and SystemVerilog
Clean, synthesisable RTL. Each block is built to be verified, not just to compile. Coding standards enforced from day one.
- SystemVerilog RTL design
- Reusable parameterised IP blocks
- Clock domain crossing handling
- Low-power and clock-gating discipline
- Linting and CDC sign-off
- Synthesis-aware coding
Verification
UVM, coverage-driven, sign-off clean
Constrained-random verification with UVM testbenches and explicit coverage goals. We close coverage before we close timing.
- UVM testbench architecture
- Functional and code coverage
- Constrained-random stimulus
- Assertion-based verification (SVA)
- Formal property verification (selected blocks)
- Regression infrastructure and triage
Analog & mixed-signal
Layout, simulation, integration
Where matching, noise, and parasitics dominate. Analog work that respects what the silicon can actually do.
- Schematic capture and simulation
- Analog and mixed-signal layout
- Post-layout simulation (PEX, MC, corners)
- AMS verification (Verilog-AMS)
- ESD and latch-up review
- Analog IP integration
Physical design
Floorplan to GDSII
Place-and-route, timing closure, IR drop, and physical sign-off for mature nodes from 180nm down to 28nm. No exotic node heroics.
- Floorplan and power planning
- Place-and-route
- Multi-corner multi-mode STA
- IR drop and EM analysis
- DRC, LVS, ERC sign-off
- Formal equivalence (LEC)
DFT
Design for test
Production test gets designed in, not bolted on. ATPG coverage targets agreed before RTL freeze.
- Scan insertion and stitching
- ATPG (stuck-at, transition)
- MBIST for embedded memories
- JTAG boundary scan
- IEEE 1500 / IJTAG wrappers
- Test program development
Tape-out & bring-up
Foundry, package, first silicon
GDSII through wafers, packaged parts, and characterised silicon ready to ship. Multi-project shuttle and full-reticle.
- Tape-out coordination with foundry
- OSAT package selection and qualification
- Wafer probe and final test programs
- Silicon bring-up and characterisation
- Reference board and demo firmware
- Production transfer to customer
EDA & tooling
The flows we actually use.
Licensed via startup and partner programs from the big three EDA vendors, plus the open tooling that lets us move fast on experiments.
Cadence
Virtuoso, Innovus, Genus, Xcelium
Synopsys
Design Compiler, VCS, IC Compiler II, PrimeTime
Siemens EDA
Questa, Calibre, Tessent
Verific
Parsers and linting platforms
GitHub / GitLab
Source control, CI, regression dashboards
Python / TCL
Flow automation and scripting
Nodes & foundries
Mature nodes, not heroics.
Mature digital
180 / 130 / 65 nm
Workhorse digital and mixed-signal — our default starting point.
Sub-100 advanced
40 / 28 nm
Where performance matters and the budget allows a tighter shuttle.
Analog / BCD
180 / 130 nm BCD
Power management, drivers, sensor front-ends.
FPGA prototyping
Xilinx / Intel
Early customer demos, software bring-up before tape-out.
Multi-project shuttle
Europractice, MOSIS, foundry direct
Low-cost first-silicon for prototypes and small volumes.
Foundries
TSMC, GF, UMC, Tower, SMIC
Selected per node, capacity, and IP availability.
Have a chip in mind?
Send a spec or a sketch. We will tell you what is feasible, what we'd change, and what it costs.
Book a call